We help customers manufacture electronic components with more advanced functionality and more highly integrated architectures with lead-free solder plating, including Sn-Ag-Cu plating, in low- to high-melting-point variants.
We used proprietary technology to successfully commercialize Sn-Ag-Cu plating with the same composition as standard lead-free mounting solder.
We can form fine patterns (bumps and wiring) on a variety of substrates such as Si wafer.
We form a uniform plating film on minuscule components and materials to add functionality (conductivity, solderability, etc.).