SERVICEContract Plating (Electronic Component Processing) Business

Contract processing for services ranging from prototype development to volume production
Lead-free solder plating technology that accommodates low- to high-melting-point variants

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Services

We help customers manufacture semiconductor packages with more advanced functionality, narrower pitches, and denser/finer circuits by using plating technology that we’ve accumulated through our core business of leadframe exterior plating.

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Shinryo’s plating technology

More advanced functionality

We help customers manufacture electronic components with more advanced functionality and more highly integrated architectures with lead-free solder plating, including Sn-Ag-Cu plating, in low- to high-melting-point variants.

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Sn-Bi-In plating technology (patent pending)

  • We successfully developed low-melting-point solder plating that can accommodate mounting temperatures of 60°C to 110°C.
  • Sn-Bi-In plating can be used to mount resin materials, compound semiconductors, piezoelectric elements, and other materials with low heat resistance.
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Sn-Ag-Cu plating technology

We used proprietary technology to successfully commercialize Sn-Ag-Cu plating with the same composition as standard lead-free mounting solder.

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Narrower pitch and denser circuits

We can form fine patterns (bumps and wiring) on a variety of substrates such as Si wafer.

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Processing service

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Development status

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Finer (more minuscule) circuits

We form a uniform plating film on minuscule components and materials to add functionality (conductivity, solderability, etc.).

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  • Materials: Metals, resins
  • Grain diameter: We have experience with grain diameters as low as 40 μm.        
  • Plating types: Cu, Ni, lead-free solder, etc. 
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  • Materials: Metals, resins, carbon materials (carbon fiber, carbon nanotubes)
  • Wire diameter: We have experience with wire diameters as low as 10 μm.
  • Plating types: Cu, Ni, lead-free solder, etc.
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CONTACTInquiries

Please contact us if your company has concerns about lowering costs or maintaining quality.